H61-Thermal Epoxy

ID AVET00H61003
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EPO-TEK™ H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications. Category: Thermal Size: 3 oz Kit
Price
$0.00
price per Kit
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Kit
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Description

EPO-TEK™ H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.

Thermal
3 oz Kit
Thermal
Oven
1
25 days
40,000-60,000cPs
@ 5 rpm
=110°C
1.32
150°C/30 min
120°C/1 hr
=20 kg
0.70 W/mK
17 x 10-6 in/in/°C (below Tg)
N/A
N/A
89D
N/A
Electronics Assembly,
Hybrid
Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
Specifications
3 oz kit
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