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H61-Thermal Epoxy
ID
AVET00H61003
EPO-TEK™ H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications. Category: Thermal Size: 3 oz Kit
Description
EPO-TEK™ H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.
| Thermal |
|
| 3 oz Kit |
|
| Thermal |
|
| Oven |
|
| 1 | |
| 25 days | |
| 40,000-60,000cPs @ 5 rpm |
|
| =110°C | |
| 1.32 | |
| 150°C/30 min 120°C/1 hr |
|
| =20 kg | |
| 0.70 W/mK | |
| 17 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 89D | |
| N/A |
|
| Electronics Assembly, Hybrid |
|
| Circuit / Electronic Assembly, Glob Top, Heat Sinking, Hybrids Microelectronics, LEDs, Non-Conductive, Packaging Materials, PCB Level Materials, Potting, Semiconductor , Wafer Level |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
Specifications
| 3 oz kit |
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