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EPO-TEK- H74 Thermal Epoxy

ID AVET0H74
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EPO TEK ® H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including dieattach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general. Category:
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Description

EPO TEK ® H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including dieattach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.

Thermal
Thermal
Oven,
Snap
2
2 hrs
45,000-65,000cPs
@ 5 rpm
=100°C
2.14
150°C/5 min
100°C/20 min
=15 kg
1.25 W/mK
21 x 10-6 in/in/°C (below Tg)
N/A
N/A
90D
N/A
Electronics Assembly,
Hybrid,
Medical,
Optical,
Semiconductor
Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
PCB Level Materials,
Semiconductor


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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