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EPO-TEK- H67-MP Thermal Epoxy
EPO-TEK- H67-MP Thermal Epoxy
EPO-TEK- H67-MP Thermal Epoxy
EPO-TEK- H67-MP Thermal Epoxy

EPO-TEK- H67-MP Thermal Epoxy

ID AVET67MP
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EPO-TEK® H67MP is a single component, thermally conductive epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. Category:
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Description

EPO-TEK® H67MP is a single component, thermally conductive epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

Thermal
Thermal
Oven
1
28 days
300,000-400,000cPs
@ 1 rpm
=90°C
N/A
150°C/1 hr
=20 kg
0.45 W/mK
16 x 10-6 in/in/°C (below Tg)
N/A
N/A
84D
N/A
Electronics Assembly,
Hybrid,
Medical,
Semiconductor
Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Medical Epoxies,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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