EPO-TEK- H20E-8 Electrical Epoxy

ID AVETH208
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O-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK®H20E.

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Description

O-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK®H20E.

Electrical
Electrical,
Thermal
Oven,
Snap
2
3 days
10,000-20,000cPs
@ 20 rpm
=80°C
4.85
150°C/30 min
120°C/15 min
80°C/90 min
=5 kg
3.5 W/mK
26 x 10-6 in/in/°C (below Tg)
N/A
N/A
66D
N/A
Electronics Assembly,
Hybrid,
Medical
Circuit / Electronic Assembly,
Electrically Conductive,
Hybrids Microelectronics,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solder Replacement


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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