EPO-TEK- H20E-HC Electrical Epoxy
ID
AVETH20H
EPO-TEK™ H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also use extensively for thermal management applications due to its high thermal conductivity. Also available in a single
Description
EPO-TEK™ H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also use extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPO-TEK™ H20E.
Electrical |
|
Electrical, Thermal |
|
Oven |
|
2 | |
2.5 days | |
3,500-6,000cPs @ 50 rpm | |
N/A | |
3.48 | |
175°C/30 min 150°C/60 min |
|
=5 kg | |
9.96 W/mK | |
53 x 10-6 in/in/°C (below Tg) | |
N/A | |
N/A | |
93A | |
N/A |
|
Electronics Assembly, Hybrid, Medical |
|
Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, LEDs, Medical Epoxies, Packaging Materials, PCB Level Materials, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
IPG- 51589 Polyester Film Tape
ID
ETIP1589
$0.00
Item Details
Dow Corning- Molykote MH62 Grease
ID
AVDC0MH62016
$0.00
SAF-T-LOK- Industrical Pipe Sealant ITPS
ID
AVSLITPS
$0.00
Item Details
Xmark- Roof Underlayment
ID
PSAMROOF4250
$210.00