LORD- Circalok 6037 Epoxy Resin
ID
AVLR6037
LORD Circalok TM 6037 epoxy resin is formulated for use with various Circalok hardeners to create a two-component epoxy system. The epoxy system is primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinksand between heat sinks and power devices.
Description
LORD Circalok TM 6037 epoxy resin is formulated for use with various Circalok hardeners to create a two-component epoxy system. The epoxy system is primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinksand between heat sinks and power devices. Circalok 6037 resin can also be mixed with Circalok hardeners for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components.
- Low Stress: exhibits low shrinkage and stress on components as it cures.
- Excellent Adhesion: provides a strong adhesion bond to a wide variety of substrates.
- Low Coefficient of Thermal Expansion: minimizes the possibility of cracking during severe temperature cycling.
Appearance: Black or Green Paste
Viscosity, cps @ 25°C: 500,000
Specific Gravity: 2.3-2.4
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
EFD- Precision Stainless Steel Tips
ID
DEEF0051
$0.00
Item Details
Dow Corning- Electrical Insulating Paste 4
ID
AVDC0004
$0.00
Item Details
Dow Corning- RTV-3120 Base
ID
AVDC3120
$0.00
Item Details
Brady- B-422- Thermal Transfer Printable Labels
ID
IPBR422L
$0.00
Item Details