LORD Circalok TM 6037 epoxy resin is formulated for use with various Circalok hardeners to create a two-component epoxy system. The epoxy system is primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinksand between heat sinks and power devices. Circalok 6037 resin can also be mixed with Circalok hardeners for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components.
- Low Stress: exhibits low shrinkage and stress on components as it cures.
- Excellent Adhesion: provides a strong adhesion bond to a wide variety of substrates.
- Low Coefficient of Thermal Expansion: minimizes the possibility of cracking during severe temperature cycling.
Appearance: Black or Green Paste
Material Safety Data Sheet (MSDS):
Technical Data Sheet:
Viscosity, cps @ 25°C: 500,000
Specific Gravity: 2.3-2.4
*Actual product colours may vary from on-screen and printed representations.