Emerson & Cuming- 285 Eccobond
ID
AVEM0285
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures
Description
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures and has good thermal cycling properties.
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet (TDS): Click Here
*Actual product shape, size and colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
Dow Corning- 732 Multi-Purpose Sealant
ID
AVDC0732
$0.00
Item Details
Dow Corning- D-321 Dry Film Lubricant
ID
AVDC0321
$0.00
Item Details
LORD- Thermoset SC-320 Silicone Encapsulant
ID
AVLRC320
$0.00
Item Details
Zipwall- Spring Loaded Pole 2 Pack
ID
PSZW2PL00000
$344.00