EPO-TEK- H21D Electrical Epoxy

ID AVETH21D
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EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. Category:
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Description

EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications.

Electrical
Electrical,
Thermal
Oven,
Snap
2
15 Hours
14,000-20,400cPs
@ 20 rpm
=100°C
2.62
150°C/1 hr
=10 kg
1.0 W/mK
42 x 10-6 in/in/°C (below Tg)
N/A
N/A
60D
N/A
Electronics Assembly,
Hybrid,
Medical
Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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