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EPO-TEK- H21D Electrical Epoxy
ID
AVETH21D
EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. Category:
Description
EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications.
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Electrical |
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Electrical, Thermal |
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Oven, Snap |
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| 2 | |
| 15 Hours | |
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14,000-20,400cPs @ 20 rpm |
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| =100°C | |
| 2.62 | |
| 150°C/1 hr | |
| =10 kg | |
| 1.0 W/mK | |
| 42 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 60D | |
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N/A |
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Electronics Assembly, Hybrid, Medical |
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Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, LCDs, LEDs, PCB Level Materials, Semiconductor , Solder Replacement, Wafer Level |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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