LORD Thermoset MD-140SP silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, power semiconductor and VLSI assembly. Thermoset MD-140SP adhesive is low stress, making it suitable for use with large die.
Thermoset MD-140SP adhesive provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper. Low ionic levels make it ideally suited for demanding semiconductor and hybrid assembly applications.
Shelf life is twelve months from date of manufacture when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
Uncured Typical Properties**
Convenient – provides a working life of up to 72 hours after loading a syringe into the dispensing equipment at room temperature.
Excellent Dispensability – allows high-speed, accurate syringe dispensing of fine dots or lines; can be used with time/pressure, positive displacement or linear dispense heads.
- Fast Cure – rapidly cures at 150°C and 180°C.
Appearance: Silver Paste
Cured Typical Properties**
Viscosity, cps @ 25°C: 30,000
Specific Gravity: 3.7
Volume Resistivity, ohm-cm @ 25°C: 1.0 x 10-4
Material Safety Data Sheet (MSDS):
Technical Data Sheet:
Thermal Conductivity***, W/mK: 12
Coefficient of Linear Thermal Expansion, ppm/°C:
alpha 1 = 60
alpha 2 = 190
Glass Transition Temperature (Tg), °C: 82
Die Shear Strength, kgf/cm2 @ 25°C: 575
Storage Modulus, MPa @ 25°C: 3300
*Actual product colours may vary from on-screen and printed representations.
**Data is typical and not to be used for specification purposes.
*** Cure for analysis 2 hours at 150°C. Measured by Laser Flash method.