LORD Circalok TM 6711 silicone encapsulant is formulated for use with various Circalok catalysts to create a two-component, thermally conductive encapsulant system with outstanding electrical properties. Circalok 6711 encapsulant is an ideal potting compound for any application where rapid heat transfer, high temperature service and a flexible system are required.
Uncured Typical Properties
- Low Viscosity: maintains low viscosity for complete and
- High Thermal Conductivity: provides thermal conductivity for applications where superior heat dissipation are required.
- Low Coefficient of Thermal Expansion: minimizes the possibility of cracking during severe temperature cycling.
Appearance: White Paste
Material Safety Data Sheet (MSDS):
Viscosity, cps @ 25°C: 30,000
Specific Gravity: 2.2
Technical Data Sheet:
*Actual product colours may vary from on-screen and printed representations.