Multicore X33-08i is a resin free, no clean, halide free liquid flux for surfaces with poor solderability from the pioneers of “no clean” technology.
Multicore X33-08i is recommended for consumer electronics and general electrical soldering applications. It has been formulated without resin/rosin to give a very clean appearance to PCBs.
Technical Data Sheet (TDS):
Material Safety Data Sheet (MSDS):
- 1 Gallon Bottle (Sold/Gallon)
Fast soldering on conventional leaded and SMD
components - shiny joints; no bridges or icicles
- Sustained activity for maximum process window
- Resin-/rosin-free to give clean appearance to soldered PCB
- No cleaning - reduces costs and eliminates CFC usage
- Minimal residues to interfere with ATE probes without cleaning
- Compatible with rosin based surface preservatives
- Foam, spray or wave application
*Actual product colours may vary from on-screen and printed representations.