384™ is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair. In high pot applications this product should be limited to a maximum of 500 volts. Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.
Material Safety Data Sheet (MSDS):
Technical Data Sheet (TDS):
|Manufacturer Part Number
||300 ml cartridge
||25 ml syringe
||25ml Efd syringe
||Kit (Syringe & Odc-Free Actv)
*Actual product colours may vary from on-screen and printed representations.