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EPO-TEK- TJ1183-LH Adhesive
ID
AVET83LH
A single component, low-halogen, electrically insulating die attach adhesive with extended pot life. Category: Thermal Conductivity: Thermal Cure Type: Oven Number of
Description
A single component, low-halogen, electrically insulating die attach adhesive with extended pot life.
| Thermal |
|
| Thermal |
|
| Oven |
|
| 1 | |
| 9 days | |
| 40,139cPs @ 10 rpm |
|
| 108°C | |
| 2.6 | |
| 150°C/1 hr | |
| 29.5 kg | |
| 0.38 W/mK | |
| N/A x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| N/A | |
| N/A |
|
| Electronics Assembly, Hybrid, Medical, Semiconductor |
|
| Circuit / Electronic Assembly, Heat Sinking, Hybrids Microelectronics, Medical Epoxies, Non-Conductive, PCB Level Materials, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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