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EPO-TEK- H77T Thermal Epoxy
ID
AVETH77T
EPO-TEK® H77T is a two component, thermally conductive, electrically insulating epoxy designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.
Description
EPO-TEK® H77T is a two component, thermally conductive, electrically insulating epoxy designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.
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Thermal |
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Thermal |
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|
Oven |
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| 2 | |
| 8 hrs | |
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23,000-34,000cPs @ 10 rpm |
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| =80°C | |
| 3 | |
| 150°C/1 hr | |
| =5 kg | |
| 1.1 W/mK | |
| 34 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 89D | |
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N/A |
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Electronics Assembly, Hybrid, Medical, Optical, Semiconductor |
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Circuit / Electronic Assembly, Heat Sinking, Hybrids Microelectronics, Opto-Packaging, PCB Level Materials |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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