EPO-TEK- H77 Thermal Epoxy

ID AVET0H77
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EPO-TEK®H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.

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Description

EPO-TEK®H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.

Thermal
Thermal
Oven
2
6 hrs
6,000-12,000cPs
@ 20 rpm
=80°C
1.4
150°C/1 hr
=5 kg
0.66 W/mK
33 x 10-6 in/in/°C (below Tg)
N/A
N/A
90D
N/A
Electronics Assembly,
Hybrid,
Semiconductor
Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Opto-Packaging,
PCB Level Materials,
Potting,
Semiconductor


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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