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EPO-TEK- H74F Thermal Epoxy
ID
AVETH74F
A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing,and opto-electronic assemblies. It may be used for flip chip under fill, sealing sensor devices packaged in TO-cans or fiber optic feed-through.
Description
A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing,and opto-electronic assemblies. It may be used for flip chip under fill, sealing sensor devices packaged in TO-cans or fiber optic feed-through. It may be considered a finer particle version of EPO-TEK®H74
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Thermal |
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Thermal |
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Oven, Snap |
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| 2 | |
| 3 hrs | |
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45,000-75,000cPs @ 5 rpm |
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| =90°C | |
| 1.9 | |
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150°C/5 min 120°C/10 min 100°C/20 min 80°C/2 hrs |
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| =15 kg | |
| 0.52 W/mK | |
| 33 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 88D | |
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N/A |
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Electronics Assembly, Hybrid, Optical, Semiconductor |
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Circuit / Electronic Assembly, Heat Sinking, Hybrids Microelectronics, Opto-Packaging, Packaging Materials, PCB Level Materials, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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