Français
EPO-TEK- H70S Thermal Epoxy
ID
AVETH70S
POTEK®H70S is a modified version ofEPO TEK®H70E, designed primarily for die stamping. It is a highly reliable,alumina-filled epoxy with a smooth, flowable consistency, designed for chip bonding in micro-electronic and opto-electronic applications.
Description
POTEK®H70S is a modified version ofEPO TEK®H70E, designed primarily for die stamping. It is a highly reliable,alumina-filled epoxy with a smooth, flowable consistency, designed for chip bonding in micro-electronic and opto-electronic applications.
|
Thermal |
|
|
Thermal |
|
|
Oven, Snap |
|
| 2 | |
| 3 days | |
| 1,300-1,800cPs @ 100 rpm | |
| >50°C | |
| 1.37 | |
|
175°C/1 min 150°C/5 min 120°C/15 min 80°C/90 min |
|
| >10 kg | |
| 0.44 W/mK | |
| 40 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 83D | |
|
N/A |
|
|
Electronics Assembly, Hybrid, Medical, Optical, Semiconductor |
|
|
Circuit / Electronic Assembly, Glob Top, Heat Sinking, Hybrids Microelectronics, Opto-Packaging, Packaging Materials, PCB Level Materials, Potting, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.