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EPO-TEK- H70E Thermal Epoxy
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EPO-TEK- H70E Thermal Epoxy
EPO-TEK- H70E Thermal Epoxy

EPO-TEK- H70E Thermal Epoxy

ID AVETH70E
0.5
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1.5
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2.5
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EPO-TEK®H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. Category: Thermal Conductivity: Thermal
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Description

EPO-TEK®H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

Thermal
Thermal
Oven,
Snap
2
56 hrs
4,000-7,000cPs
@ 50 rpm
=80°C
1.17
175°C/1 min
150°C/5 min
120°C/15 min
80°C/90 min
=10 kg
0.9 W/mK
15 x 10-6 in/in/°C (below Tg)
N/A
N/A
83D
N/A
Electronics Assembly,
Hybrid,
Optical,
Semiconductor
Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
LEDs,
Non-Conductive,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor ,
Wafer Level


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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$0.00 Item Details
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