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EPO-TEK- H70E-4 Thermal Epoxy
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EPO-TEK- H70E-4 Thermal Epoxy
EPO-TEK- H70E-4 Thermal Epoxy

EPO-TEK- H70E-4 Thermal Epoxy

ID AVET70E4
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
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EPO-TEK®H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronics and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level. Category:
Price
      $0.00
price per Kit
excl. tax
Image title
 Image title   Limited Stock Image title   In Stock
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Description

EPO-TEK®H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronics and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level.

Thermal
Thermal
Oven,
Snap
2
2.5 days
20,000 - 40,000cPs @ 10 rpm
=80°C
3.2
120°C/15 min
80°C/1 hr
50°C/12 hrs
>5 kg
0.57 W/mK
17 x 10-6 in/in/°C (below Tg)
N/A
N/A
67D
N/A
Electronics Assembly,
Hybrid,
Medical,
Optical,
Semiconductor
Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Medical Epoxies,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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