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EPO-TEK- H70E-4 Thermal Epoxy
ID
AVET70E4
EPO-TEK®H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronics and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level. Category:
Description
EPO-TEK®H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronics and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level.
| Thermal |
|
| Thermal |
|
| Oven, Snap |
|
| 2 | |
| 2.5 days | |
| 20,000 - 40,000cPs @ 10 rpm | |
| =80°C | |
| 3.2 | |
| 120°C/15 min 80°C/1 hr 50°C/12 hrs |
|
| >5 kg | |
| 0.57 W/mK | |
| 17 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 67D | |
| N/A |
|
| Electronics Assembly, Hybrid, Medical, Optical, Semiconductor |
|
| Circuit / Electronic Assembly, Glob Top, Heat Sinking, Hybrids Microelectronics, Medical Epoxies, Opto-Packaging, Packaging Materials, PCB Level Materials, Potting, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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