EPO-TEK- H70E-2 Thermal Epoxy

ID AVET70E2
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EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.

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Description

EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.

Thermal
Thermal
Oven
2
2 days
9,000-15,000cPs @ 20 rpm
=80°C
1.69
175°C/1 min
150°C/5 min
120°C/15 min
80°C/90 min
>5 kg
1.0 W/mK
20 x 10-6 in/in/°C (below Tg)
N/A
N/A
65D
N/A
Electronics Assembly,
Hybrid,
Optical,
Semiconductor
Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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