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EPO-TEK- H70E-2 Thermal Epoxy
ID
AVET70E2
EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.
Description
EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.
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Thermal |
|
|
Thermal |
|
|
Oven |
|
| 2 | |
| 2 days | |
| 9,000-15,000cPs @ 20 rpm | |
| =80°C | |
| 1.69 | |
|
175°C/1 min 150°C/5 min 120°C/15 min 80°C/90 min |
|
| >5 kg | |
| 1.0 W/mK | |
| 20 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 65D | |
|
N/A |
|
|
Electronics Assembly, Hybrid, Optical, Semiconductor |
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|
Circuit / Electronic Assembly, Glob Top, Heat Sinking, Hybrids Microelectronics, Opto-Packaging, Packaging Materials, PCB Level Materials, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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