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EPO-TEK- H20E Electrical Epoxy
ID
AVETH20E
EPO-TEK®H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be
Description
EPO-TEK®H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.
| Electrical |
|
| Electrical, Thermal |
|
| Oven, Snap |
|
| 2 | |
| 2.5 days | |
| 2,200-3,200cPs @ 100 rpm |
|
| =80°C | |
| 4.63 | |
| 175°C/45 sec 150°C/5 min 120°C/15 min 100°C/2 hrs 80°C/3 hrs |
|
| >10 kg | |
| 2.5 W/mK | |
| 31 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 75D | |
| N/A |
|
| Electronics Assembly, Hybrid, Medical, Semiconductor, Solar |
|
| Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, LCDs, LEDs, Medical Epoxies, Packaging Materials, PCB Level Materials, Semiconductor , Solar, Solder Replacement, USP Class VI Approved |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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