EPO-TEK- H20E Electrical Epoxy

ID AVETH20E
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EPO-TEK®H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be

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Description

EPO-TEK®H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.

Electrical
Electrical,
Thermal
Oven,
Snap
2
2.5 days
2,200-3,200cPs
@ 100 rpm
=80°C
4.63
175°C/45 sec
150°C/5 min
120°C/15 min
100°C/2 hrs
80°C/3 hrs
>10 kg
2.5 W/mK
31 x 10-6 in/in/°C (below Tg)
N/A
N/A
75D
N/A
Electronics Assembly,
Hybrid,
Medical,
Semiconductor,
Solar
Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
Medical Epoxies,
Packaging Materials,
PCB Level Materials,
Semiconductor ,
Solar,
Solder Replacement,
USP Class VI Approved


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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