EPO-TEK- EE129-4 Electrical Adhesive

EPO-TEK®EE 129-4 is a room temperature cure, silver-filled epoxy, designed for making electrical connections in circuit assembly, semiconductor, and LCD applications.

• Low temperature cures capable from 23°C to 80°C.
• This allows for lower cost plastics such as those found in flex circuits or medical devices.
• Suggested for cryogenic cooling applications.
• Works well for aerospace hybrid circuits and ITO electrodes in LCD packaging and assembly.
• Reasonable pot life of 3 hours allows for mass production.
• Smooth thixotropic paste allows for application by automatic dispensing equipment. It can also be applied by hand, spatula, or screen printing.
• Works well with surfaces like Au, Ag-Pd, Cu, brass, Kovar, stainless steel; as well as ceramic, PCB, solder masks, most plastics and glasses.
• 1:1 mix ratio permits varied packing opportunities such as “bi-pax” and static mixing.

*Actual product colours may vary from on-screen and printed representations.