Dow Corning 340 Heat Sink Compound: White, non-curing and non-flowing thermally conductive compound. Dow Corning™ 340 Heat Sink Compound is suitable for thermal coupling of electrical/electronic devices to heat sinks.
- Moderate thermal conductivity
- No need for ovens or curing
- Heat flow away from electronic components can increase reliability
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
Shelf Life: 1800 Days
Specific Gravity @ 25C: 2.1
Thermal Conductivity: 0.67 Watts per meter K
Thickening System: Metal Oxide
Viscosity: 542000 mPa.s
Worked Penetration: 290 mm/10
*Actual product colours may vary from on-screen and printer representations.