EPO-TEK- H74F Thermal Epoxy

ID AVETH74F
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A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing,and opto-electronic assemblies. It may be used for flip chip under fill, sealing sensor devices packaged in TO-cans or fiber optic feed-through.
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Description

A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing,and opto-electronic assemblies. It may be used for flip chip under fill, sealing sensor devices packaged in TO-cans or fiber optic feed-through. It may be considered a finer particle version of EPO-TEK®H74

Thermal
Thermal
Oven,
Snap
2
3 hrs
45,000-75,000cPs
@ 5 rpm
=90°C
1.9
150°C/5 min
120°C/10 min
100°C/20 min
80°C/2 hrs
=15 kg
0.52 W/mK
33 x 10-6 in/in/°C (below Tg)
N/A
N/A
88D
N/A
Electronics Assembly,
Hybrid,
Optical,
Semiconductor
Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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