EPO-TEK- H70S Thermal Epoxy

ID AVETH70S
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POTEK®H70S is a modified version ofEPO TEK®H70E, designed primarily for die stamping. It is a highly reliable,alumina-filled epoxy with a smooth, flowable consistency, designed for chip bonding in micro-electronic and opto-electronic applications.
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Description

POTEK®H70S is a modified version ofEPO TEK®H70E, designed primarily for die stamping. It is a highly reliable,alumina-filled epoxy with a smooth, flowable consistency, designed for chip bonding in micro-electronic and opto-electronic applications.

Thermal
Thermal
Oven,
Snap
2
3 days
1,300-1,800cPs @ 100 rpm
>50°C
1.37
175°C/1 min
150°C/5 min
120°C/15 min
80°C/90 min
>10 kg
0.44 W/mK
40 x 10-6 in/in/°C (below Tg)
N/A
N/A
83D
N/A
Electronics Assembly,
Hybrid,
Medical,
Optical,
Semiconductor
Circuit / Electronic Assembly,
Glob Top,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Potting,
Semiconductor


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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