EPO-TEK- H75 Thermal Epoxy

ID AVET0H75
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A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing,and opto-electronic assemblies. It may be considered a higher viscosity alternative to EPO-TEK® H74.
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Description

A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing,and opto-electronic assemblies. It may be considered a higher viscosity alternative to EPO-TEK® H74.

Thermal
Thermal
Oven,
Snap
2
3 hrs
300,000-400,000cPs
@ 0.5 rpm
=100°C
N/A
150°C/5 min
100°C/30 min
80°C/2 hrs
=20 kg
0.66 W/mK
29 x 10-6 in/in/°C (below Tg)
N/A
N/A
95D
N/A
Electronics Assembly,
Hybrid,
Optical,
Semiconductor
Circuit / Electronic Assembly,
Heat Sinking,
Hybrids Microelectronics,
Opto-Packaging,
Packaging Materials,
PCB Level Materials,
Semiconductor


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
Specifications
3 oz kit
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