EPO-TEK- H70E-2 Thermal Epoxy
ID
AVET70E2
EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.
Description
EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.
Thermal |
|
Thermal |
|
Oven |
|
2 | |
2 days | |
9,000-15,000cPs @ 20 rpm | |
=80°C | |
1.69 | |
175°C/1 min 150°C/5 min 120°C/15 min 80°C/90 min |
|
>5 kg | |
1.0 W/mK | |
20 x 10-6 in/in/°C (below Tg) | |
N/A | |
N/A | |
65D | |
N/A |
|
Electronics Assembly, Hybrid, Optical, Semiconductor |
|
Circuit / Electronic Assembly, Glob Top, Heat Sinking, Hybrids Microelectronics, Opto-Packaging, Packaging Materials, PCB Level Materials, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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