EPO-TEK- 921 Thermal Compound
ID
AVET0921
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can bean adhesive for mounting heat sinks and substrates, a seal for many types of packages, or
Description
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can bean adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
Thermal |
|
Thermal |
|
Oven, Snap |
|
2 | |
6 hrs | |
20,000-40,000cPs @ 10 rpm |
|
=90°C | |
2.5 | |
150°C/5 min 120°C/10 min 100°C/20 min |
|
=20 kg | |
1.4 W/mK | |
26 x 10-6 in/in/°C (below Tg) | |
N/A | |
N/A | |
93D | |
N/A |
|
Electronics Assembly, General, Hybrid, Optical, Semiconductor |
|
Circuit / Electronic Assembly, Hybrids Microelectronics, PCB Level Materials, Potting, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
Huntsman- Araldite 2011 Epoxy Adhesive
ID
AVXXZ00007NE
$0.00
LORD- Gelease MG-121 Thermal Conducive Gel
ID
AVLRZ00006NB
$0.00
IPG- 4616 Glass Cloth Tape
ID
ETDT0510
$0.00
Item Details
Bostik- 1096M Liquid Adhesive
ID
AVBO1096
$0.00
Item Details