EPO-TEK- H44 Electrical Epoxy
ID
AVET0H44
EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging. Category:
Description
EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.
Electrical |
|
Electrical, Thermal |
|
Oven |
|
1 | |
N/A | |
>819,200cPs @ 0.5 rpm |
|
=100°C | |
N/A | |
150°C/1hr | |
=10 kg | |
Upon Request W/mK | |
Upon Request x 10-6 in/in/°C (below Tg) | |
N/A | |
N/A | |
Upon Request | |
N/A |
|
Electronics Assembly, Hybrid |
|
Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, PCB Level Materials, Semiconductor , Solder Replacement, Wafer Level |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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