Emerson & Cuming- 285 Eccobond
ID
AVEM0285
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures
Description
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures and has good thermal cycling properties.
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet (TDS): Click Here
*Actual product shape, size and colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
Si-Coat- 532 Anti-Graffiti Spray Grade, Low VOC
ID
PSCSG532
$0.00
Item Details
LORD- Chemlok 218 Adhesive
ID
AVAVZ00007MS
$0.00
Arno- C222 Polyimide Backed Film Tape
ID
ETAR0222
$0.00
Item Details
IPG- 4617 Arylic Glass Cloth Tape
ID
ETDT0580
$0.00
Item Details