Emerson & Cuming- 285 Eccobond
ID
AVEM0285
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures
Description
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures and has good thermal cycling properties.
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet (TDS): Click Here
*Actual product shape, size and colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
#3 Flatback Paper tape
ID
ET3M0003
$0.00
Item Details
Brady- B-422- Thermal Transfer Printable Labels
ID
IPBR422L
$0.00
Item Details
Zipwall- Carry Bag
ID
PSZWCB100000
$142.00
Xmark 9350 Tub Coat
ID
PSGCXMT9
$145.14
Item Details