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EPO-TEK- H20E-175 Epoxy
ID
AVETH201
TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK®H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.
Description
TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK®H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.
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Electrical |
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Electrical, Thermal |
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Oven |
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| 2 | |
| 3.5 Days | |
| 2,800-3,800cPs @ 100 rpm | |
| =85°C | |
| 3.1 | |
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180°C/1 hr 150°C/2 hrs |
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| =10 kg | |
| 2.04 W/mK | |
| 20 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 70D | |
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N/A |
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Electronics Assembly, Hybrid, Medical, Semiconductor |
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Circuit / Electronic Assembly, Electrically Conductive, Hybrids Microelectronics, Medical Epoxies, Packaging Materials, PCB Level Materials, Semiconductor , Solder Replacement |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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