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EPO-TEK- 920 Thermal Epoxy
ID
AVET0920
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or
Description
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. It is a NASA approved, low out gassing epoxy.
| Thermal |
|
| Thermal |
|
| Oven, Snap |
|
| 2 | |
| 5 hrs | |
| 13,000-20,000cPs @ 20 rpm |
|
| =90°C | |
| 2.1 | |
| 150°C/5 min 120°C/10 min 100°C/20 min |
|
| =15 kg | |
| 0.97 W/mK | |
| 24 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 90D | |
| N/A |
|
| Electronics Assembly, General, Hybrid, Optical, Semiconductor |
|
| Circuit / Electronic Assembly, Heat Sinking, Hybrids Microelectronics, Opto-Packaging, PCB Level Materials, Potting, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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