Emerson & Cuming- 285 Eccobond
ID
AVEM0285
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures
Description
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures and has good thermal cycling properties.
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet (TDS): Click Here
*Actual product shape, size and colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
Pacer Technology- RX-700 Adhesive
ID
AVPAX700
$0.00
Item Details
Dow Corning- RTV-3112 Base
ID
AVDC3112
$0.00
Item Details
Patco- 1800 Flame Retardant Galley Tape
ID
ITPL1800
$0.00
Item Details
Si-Coat- 579 Anti-Corrosion Protective Coating
ID
PSCSC579
$0.00
Item Details