EPO-TEK- H22 Electrical Epoxy

ID AVET0H22
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EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages. Category:
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Description

EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.

Electrical
Electrical,
Thermal
Oven,
Snap
2
16 Hours
12,000-20,000cPs
@ 20 rpm
=100°C
2.36
150°C/5 min
120°C/10 min
100°C/20 min
80°C/45 min
=5 kg
0.94 W/mK
39 x 10-6 in/in/°C (below Tg)
N/A
N/A
80D
N/A
Electronics Assembly,
Hybrid,
Medical
Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
LCDs,
LEDs,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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