EPO-TEK- 921 Thermal Compound
ID
AVET0921
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can bean adhesive for mounting heat sinks and substrates, a seal for many types of packages, or
Description
A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can bean adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
Thermal |
|
Thermal |
|
Oven, Snap |
|
2 | |
6 hrs | |
20,000-40,000cPs @ 10 rpm |
|
=90°C | |
2.5 | |
150°C/5 min 120°C/10 min 100°C/20 min |
|
=20 kg | |
1.4 W/mK | |
26 x 10-6 in/in/°C (below Tg) | |
N/A | |
N/A | |
93D | |
N/A |
|
Electronics Assembly, General, Hybrid, Optical, Semiconductor |
|
Circuit / Electronic Assembly, Hybrids Microelectronics, PCB Level Materials, Potting, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
Loctite 262- High Strength Red Threadlocker
ID
AVLO0262
$0.00
Item Details
3M- 4693H Industrial Plastic Adhesive
ID
AV3M693H
$0.00
Item Details
3M- 4 Scotchcast Electrical Resin
ID
AV3M0004
$0.00
Inquire
Plasti-Dip Merchandiser
ID
HWMP0084
$0.00
Item Details