Emerson & Cuming- 285 Eccobond
ID
AVEM0285
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures
Description
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures and has good thermal cycling properties.
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet (TDS): Click Here
*Actual product shape, size and colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
LORD- 7545 A/F Urethane Adhesive
ID
AVLR545F
$0.00
Item Details
Loctite-401 Prism Instant Adhesive
ID
AVLO0401
$0.00
Item Details
Momentive- SCS1200 Silicone Glazing Sealant
ID
AVGE1200
$0.00
Item Details
Loctite- Eccobond EO1072
ID
AVLO1072
$0.00
Item Details