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Paisley-TimTronics
TIMTRONICS
INNOVATOR OF THERMAL
INTERFACE MATERIALS

GREASES AND ADHESIVES

Our comprehensive line of thermal interface materials are here to help you deliver high-performance solutions

White Ice 510FG: Food Grade Heat Sink Compound

Product Description:

White Ice 510FG is a Non-Reactive, Silicone, Thermally Conductive food grade thermal grease with low thermal resistance and a soft, non-flowable consistency. This product is formulated with FDA (Food & Drug Administration) approved ingredients in compliance with CFR, Title 21 paragraph 178.3570 of the FDA guidelines and NSF Registered. This product is acceptable as incidental food contact for use in and around food processing areas.

Key Features and Benefits:

  • Good Thermal Performance- ( 0.80 W/m °k)
  • Low Interface Thermal Resistance. – ( 0.05 °C-In2 /W)
  • Thin Bond lines to ≤1 mil
  • Low bleed and evaporation
  • Non-Toxic/ NSF Registered
  • Re-workable/Easy to Remove
  • Easy to Apply by Dispensing or Screen Printing/Stencil

Typical Applications:

White Ice 510FG Heat Sink Compound is applied to the any electronic devices for heat transfer which is located in and around food processing areas. Also industrial applications include mounting studs of transistors, diodes and silicone controlled rectifiers. In these situations, a small amount of the thermal grease is applied using screen printing/stencil methods. It is also used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballasts; thermal joints; thermocouple wells; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.), automotive and electrical.

Property White Ice 510 FG
Thermal Conductivity (W/m °K) 0.8
Thermal Resistance (°C-In2W) 0.05
Dielectric Constant 4.4
Volume Resistivity
(Ohm-cm)
1014
Operating Temperature
Ranges (°C)
-55 to 200

Shelf-Life:

5 years at room temperature (25 °C) in unopened containers. Slight settling of the filler may occur during long-term storage. In this case, it is recommended to re-disperse the filler by hand or mechanical mixing. Refrigerate material at 0-10 °C to avoid any settling.

Clean Up:

Standard approved clean-up and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite clean-up. However, when disposable containers are impractical, White Ice 510FG can be removed by cleaning solvents with such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.

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Red Ice: High Temperature Thermal Compounds

Product Description:

Red Ice 600 series are high temperature stable thermal greases engineered with special aero space fluid technology to eliminate compound "dry out" problems due to continuous operating temperature above 200 °C. This series of thermal compounds has shown outstanding heat transfer and high temperature stability for all types of electronic and industrial applications. Recommended for aero space application because of low to zero out gassing, No dry out.

Typical Applications:

Aero Space applications, Heater cartridges, Thermistors, RTD, Thermocouple wells, Portable heaters and Tank heaters.

Most Popular Products:

  • Red Ice 611HTC: High thermal conductivity with high temperature stability. Rated up to 360 °C. Meets NASA out gassing requirements.
  • Red Ice 611: Low Thermally Conductive with high temperature stability. Rated up to 360 °C. Meets NASA out gassing requirements. Commonly used between heating element and plate.
  • Red Ice 613: Low cost solution for high temperature application, Rated up to 250 °C.

Property 610 611 611HTC 613
Type Non Silicone Non Silicone Non Siicone Non Silicone
Thermal Conductivity (W/m °K) 1.0 0.8 3.2 1.2
Thermal Resistance (°C-In2/W) 0.05 0.06 0.015 0.04
Dielectric Constant @1KHz 4.9 4.8 4.8 4.5
Volume Resistivity (Ohm-cm) 1014 1014 1014 1014
Operating Temperature Ranges (°C) -55 to 300 -55 to 360 -55 to 360 -55 to 250

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Black Ice and Silver Ice: Electrically Conductive Compounds

Product Description:

Black Ice 700 series are electrically and thermally conductive greases engineered with highly conductive fillers and silicone/non silicone fluids. Excellent wetting and spreadability with screen printable consistency. The 700 series is ideal for low power applications that require static drain, grounding, and soft electronics connection. High thermal conductivity ratings up to 7 W/mºK are readily available.

Typical Applications:

High power electrical applications, Power switches, Circuit breakers, Grounding semiconductor components and high power cpu to heat sink.

Most Popular Products:

  • Silver Ice 710 & 710NS: Pure silver fortified thermal greases, non curable system. Thermal conductivity of 7 W/mºK. Direct replacement of “Arctic Silver” products. Recommend for high heat flux & thin film applications.
  • Black Ice 711: Low cost solutions for electrical contact applications.

Property Silver Ice 710 Silver Ice 710NS 711 712
Type Non Silicone Non SIlicone Non SIlicone Silicone
Thermal Conductivity (W/m °K) 7.0 7.0 2.2 2.2
Thermal Resistance (°C-In2/W) 0.01 0.01 0.02 0.02
Dielectric Constant (@1KHz) N/A N/A N/A N/A
Volume Resistivity (Ohm-cm) <0.01 <0.01 <25 <25
Operating Temperature Ranges (°C) -55 to 200 -55 to 200 -55 to 200 -55 to 200

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EJC: Electrical Joint Compounds

Product Description:

TIM-Electrical Joint Compounds (EJC) is specially formulated with latest technology to prevent oxide film formation on metal surfaces and prevents corrosion. It offers superior weathering characteristics over wide temperature ranges, and provides highly conductive tight joints. Proprietary filler particles help in penetrating oxide films and act as electrical bridges between conductor strands, aid in gripping conductor, improve electrical conductivity and enhance integrity of the connection.

Surface contamination, especially surface oxide, must be expected on all conductors, these surface oxide films are insulators and must be broken down to achieve the metal-to-metal contact required for efficient electrical connections. Aluminum oxide, in particular, forms very rapidly; therefore, aluminum conductors must be thoroughly cleaned by use of an emery cloth prior to making the connection, In addition to cleaning, surface should be covered with joint compound to exclude moisture, thus preventing the oxide from reforming

Most Popular Products:

  • EJC 744: Gritted electrical joint compound is recommended for all aluminum and copper compression connections. It is not recommended as lubricant on threaded fittings.
  • EJC 745NS: Non-gritted Non-Silicone electrical joint compound recommended for No-Drip application for aluminum and copper connectors.
  • EJC 745SL: Non-gritted Silicone electrical joint compound recommended for rigid bus connection, bolted flat-pad connection between aluminum and aluminum and copper applications.

Property EJC 744 EJC 745NS EJC 745SL
Type Non-Silicone Non-Silicone Silicone
Colour Grey Grey Grey
Fillers Gritted Non Gritted Non Gritted
Service Temperature Range °C -40 to 150 -40 to 150 -55 to 200
Thermal Conductivity W/m°k 0.5 0.8 1.0

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Blue Ice: Non Silicone Thermal Compounds

Product Description:

Blue Ice 400 series are unique synthetic thermal greases engineered to provide low bleed and oil migration to prevent component contamination associated with silicone greases. They offer superior thermal conductivity and low thermal resistance with long term stability.

Typical Applications:

CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, TEC modules, telecommunication hardware etc.

Most Popular Products:

  • Grey Ice 4100: High thermal conductivity/Low resistance/Thin bond line thickness.
  • Blue Ice 411: Direct replacement of standard silicone grease (Dow 340).
  • Blue Ice 425: Engineered to clean easily with water or aqueous detergent cleaning solutions, thus eliminating the use of a flammable solvent.

Property 410 411 412 4100 414 425
Thermal Conductivity (W/m °K) 0.8 0.8 2.0 3.2 3.7 1.2
Thermal Resistance (°C-In2/W) 0.05 0.05 0.03 0.014 0.014 0.012
Dielectric Constant (@1KHz) 4.6 4.6 4.5 2.8 2.8 4.8
Volume Resistivity (Ohm-cm) 1014 1014 1012 1010 1010 N/A
Operating Temperature Ranges (°C) -55 to 200 -55 to 200 -55 to 200 -55 to 200 -55 to 200 -55 to 150

White Ice: Silicone Thermal Compounds

Product Description:

White Ice 500 series are silicone based thermal greases engineered with special binding agents to reduce bleed and oil separation. These compounds offer excellent wetting properties, spreadability and the low viscosity formulation makes them easy to apply to thin bond line thickness for minimum thermal resistance. Timtronics silicone compounds offer superior conductivity, low thermal resistance and long term stability.

Typical Applications:

CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, TEC modules, Telecommunication hardware, Thermistors, RTD and Thermocouple wells.

Most Popular Products:

  • Grey Ice 5100: High thermal conductivity/Low resistance/Thin bond line thickness.
  • White Ice 510: Standard silicone thermal grease, direct replacement of Dow 340 and Wakefield 120.
  • White Ice 512: Low cost, high thermally conductive grease.

Property 510 510FG
(Food Grade)
512 5100 514
Thermal Conductivity (W/m °K) 0.8 0.8 2.0 3.2 3.7
Thermal Resistance (°C-In2/W) 0.05 0.05 0.03 0.014 0.014
Dielectric Constant (@1KHz) 4.4 4.4 4.1 3.7 2.8
Volume Resistivity (Ohm-cm) 1014 1014 1014 1012 1010
Operating Temperature Ranges (°C) -55 to 200 -55 to 200 -55 to 200 -55 to 200 -55 to 200

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TIM-800: Thermally Conductive Epoxies/Adhesives

Product Description:

TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.

Typical Applications:

Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications.

Most Popular Products:

  • TIM-813: One part heat cure system, excellent conductivity and bond strength at high temperature.
  • TIM-818: High strength, thermally conductive adhesive, flash cure in 5 minutes. No mix, two part system to replace mechanical clips, fasteners or tapes in securing heat generating devices and heat sink.

Property 813 813HTC 816 816HTC 818
Thermal Conductivity (W/mºK) 1.5 2.7 0.85 2.7 0.8
Type/Cure One Part Heat Cure One Part Heat Cure Two Part RT Cure Two Part RT Cure Two Part No Mix
Flash cure
Pot life (100grams) 30 min @ 80°C 30 min @ 80°C 30 min @ 25°C 30 min @ 25°C 5 mins @ 25°C
Shelf life 4 months @25ºC 4 months @25ºC 2 years @25ºC 2 years @25ºC 1 years @25ºC
Dielectric Strength (V/Mil) 460 460 420 420 570
Max. Service Temperature (ºC) 270 270 150 150 150

Electrically Conductive

Product Description:

Electrically conductive adhesives are designed with pure silver and resin and are typically used for microelectronic applications. All products feature very high purity, low ionic content, wide operating temperature range and excellent electrical conductivity even after exposure of 1000 hours at 150°C.

Typical Applications:

Die-attach, chip bonding, cold soldering and other micro electronics bonding applications.

Property 897M-2 830M-1
Thermal Conductivity (W/mºK) 1.5 2.7
Type/Cure One Part Heat Cure Two Part RT Cure
Pot Life (100grams) 30 min @ 80°C 60 min @ 25°C
Cure Schedule 60 min @ 100°C 48 hrs @ 25°C
Shelf Life 4 months @ 0°C 1 year @ 25°C
Volume Resistivity (Ohm-cm) 0.0004 0.002
Max. Service Temperature (ºC) 140 140

Thermally Conductive
Potting Compounds (TIM-PC Series)

Product Description:

TIM-PC series are pourable, filled epoxy resin systems offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. These compounds transfer heat rapidly, thereby eliminating hot spots and increasing the operating efficiency of most encapsulated devices. The low shrinkage design feature minimizes risk of damage to fragile components.

Typical Applications:

These products are designed for protecting components in applications such as densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.

Property 8550TC 8006M-4 8207M-1 8850FT
Type Silicone Epoxy Resin Epoxy Resin Epoxy Resin
Thermal Conductivity W/mºK 1.2 0.63 0.60 1.3
Type/Cure Two Part-RT Cure Two Part-RT Cure Two Part-RT Cure Two Part-RT Cure
Mix Ratio 100:100 100:12 100:100 Depends on Hardener
Pot Life (100grams) 30 mins @ 25°C 2 hrs @ 25°C 1-2 hrs @ 25°C 30 mins @ 25°C
Cure Schedule 24-48 hrs @ 25°C 24-48 hrs @ 25°C 24-48 hrs @ 25°C 24-48 hrs @ 25°C
Shelf life 1 Year @ 25ºC 1 Year @ 25ºC 1 Year @ 25ºC 1 Year @ 25ºC
Dielectric strength (V/Mil) 460 480 415 460
Max. Service Temperature (ºC) 140 120 110 140

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TIM-GAP: Thermally Conductive Gap Fillers

Product Description: TIM-GAP is designed to meet industry’s growing need for interface material with high conductivity and greater conformability for easier application. Electrically isolating property allows its use in applications requiring isolations between heat sinks and high voltage, bare leaded devices. Available in Silicone and Non Silicone formulas with thermal conductivity up to 11 W/mºK.

Typical Application: Gap Fillers are used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. Gap Filler materials allow the designer to be less concerned with components proximity to heat sinks or heat spreaders.

Most Popular Products:

  • TIM-GAP 1102: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. High thermal conductivity (2.4 W/mºK) with low modulus.
  • TIM-GAP 1106: Highly conformable, thermally conductive with electrically insulated. Commonly used in uneven, irregular surfaces to fill air gaps. High thermal conductivity (6W/mºK) with low modulus.
  • TIM-GAP ULTRA SOFT: Specially designed for extremely low stress applications, clean, production friendly, lowest modulus type, viscoelastic thermal interface material.
  • TIM-GAP NS: Non-Silicone gap filler specially formulated to replace silicone materials due to the silicone oil extraction and contamination. Suitable for aerospace and military applications.

Physical Property Test
Method
1101 1102 1103 1106 HTC-11 SOFT ULTRA SOFT NS
Type Silicone Silicone Silicone Silicone Silicone Silicone Silicone Non-Silicone
Thermal
Conductivity
(W/m °k)
ASTM
D5470
Modified
1.4 2.4 2.8 6.0 11.0 1.3 1.5 1.6
Thermal
Resistance (°Cin2/W)
TO-3
Method
2.10
(0.1”)
1.7
(0.1”)
1.1
(0.08”)
0.31
(0.04”)
0.22
(0.06”)
0.90
(0.02”)
0.99
(0.08”)
0.72
(0.02”)
Volume
Resistivity
ASTM
D257
1014 1014 1012 1012 1011 1010 1013 1015
Hardness Shore (00) ASTM
D2240
48 48 54
54 N/A 48 <5 53
Elongation (%) ASTM
D412
100 100 65 53 N/A 250 320 150
Max.Service
Temperature (°C)
200 200 200 200 200 200 200 1110
Available
Thickness (mm)
0.5 to 5.0 0.5 to 5.0
0.5 to 5.0 0.5 to 5.0 0.5 to 5.0 1.5, 2.0, 2.5
0.5 to 3.0
2 to 5
0.5, 1.0, 2.0

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TIM-PAD: Thermally Conductive Pads

Product Description: TIM-PAD is a family of thermally conductive and electrically insulating silicone pads. They are clean, production friendly and efficient alternative to mica, ceramics or grease and will provide superb protection against damage due to deformation, shock or vibration. Available with or without adhesive for easy handling and installation.

Typical Application: Interface between a power transistor, CPU or other heat-generating components. Isolate electrical components and power sources from heat sink and/or mounting brackets. Interface for discrete semiconductors requiring low pressure spring clip mounting. Medical devices, military and industrial controls.

Most Popular Products:

  • TIM-PAD 1001: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. Excellent mechanical and physical characteristics with efficient heat dissipation. Flame retardant with excellent cut-through resistance and resistance to damage from cleaning agents.
  • TIM-PAD 1003: Offers high thermal conductivity (3W/m°k) and high dielectric properties.
  • TIM-GEL PAD: Very soft, highly conformable pad provides superb protection against damage due to deformation as well as shock or vibration. Gel like modulus provides stress absorbing flexibility.
Physical Property Test Method
1001 1002 1003 GEL-PAD
Type Silicone Silicone Silicone Silicone
Thermal Conductivity (W/m °k) ASTM
D5470
Modified
1.1 1.6 3.0 1.6
Thermal Resistance (°Cin2/W)
TO-3
Method
0.51
(0.08”)
0.55
(0.08”)
0.3
(0.08”)
0.35
(0.01”)
Volume Resistivity (ohm - cm) ASTM
D257
1015 1015 1015 1015
Hardness Shore (00) ASTM
D2240
86 93 84 49
Elongation (%) ASTM
D412
<2 <2 <3 N/A
Max.Service Temperature (°C) 200 200 200 150
Available thickness (mm) 0.15, 0.20, 0.30 0.15, 0.20, 0.30 0.20, 0.30, 0.45, 0.85 0.20, 0.30, 0.45, 0.85 0.25

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TIM-GAP: Thermally Conductive Gap Fillers

Product Description: TIM-LGF are thermally conductive liquid gap filler materials formulated to provide a balance of cured material properties, highlighted by “gel-like” modules and good compression set or memory. This material is available in thermally conductive & electrically insulating or conductive, one part or two part, room or elevated temperature curing system. Form-in-place gap fillers are ideal for applying any thickness with little or no stress.

Typical Application: LED bonding, PCBA to housing, discrete component to heat spreader, Computer and Peripherals and Automotive Electronics.

Most Popular Products:

  • TIM-LGF 2000: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. High thermal conductivity (2.4 W/mºK) with low modulus.
  • TIM-LGF 2004: Two part, room temperature cure, simple 1:1 mix ratio for easy application. Forms soft elastomer in 5 minutes when expose to heat. Very efficient heat dissipater.

Property 2000 2001 2002 2004
Viscosity (cps) 150,000 600,000
500,000
150,000
Mix Ratio One Part
Heat Cure
One Part
RTV
One Part
RTV
Two Part
1:1
Thermal Conductivity (W/ m °K) 2.0 0.63 N/A 2.0
Volume Resistivity (ohm - cm) 1012 1015 0.09 1012
Cure time @ 25°C N/A 72 hrs
24 hrs
2 hrs
Cure time @ 120°C 30 mins
N/A
N/A
5 min
Pot Life @ 25°C 24 hrs
8 mins
15 mins
1 hr
Hardness, shore 00/(A) 70 40 (A)
40 (A)
70

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TIM-PUTTY: Thermally Conductive Dispensable Putties

Product Description: TIM-PUTTY is ‘Ultra Soft” and highly conformable paste- type gap filler. Its “ultra soft” consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. TIM-PUTTY easily forms and adheres to most surfaces, shapes and sizes of components with very low compression force. Non-Silicone formulas avoid silicone contaminations to delicate devices. It can be easily dispensed from cartridges or pail using pneumatic dispenser.

Typical Application: TIM-PUTTY is used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. TIM-Putty materials allow the designer to be less concerned of CTE stresses during thermal cycling.

Most Popular Products:

  • TIM-PUTTY 418: Non-Silicone, cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. High thermal conductivity (2.1W/mºK) with low modulus
  • TIM-PUTTY 418HTC: Non-Silicone, highly conformable, thermally conductive and electrically Insulating. Commonly used in uneven, irregular surfaces to fills air gaps. High thermal conductivity (3.2W/mºK) with low modulus.

Availability: Tim-Putty are generally supplied in 30 cc syringe, 6 & 12 oz cartridge or 5 gallon pail.

Property 418 418HTC 519
Type Non-Silicone Non-Silicone Silicone
Consistency Soft Paste
Soft Paste
Soft Paste
Colour White/Grey Grey White
Density (g/cc)
2.7 2.2 2.8
Thermal
Conductivity
(W/m°K)
2.1 3.2 1.5
Service
Temperature
(°C)
-50 to 200 °C -50 to 200 °C -50 to 200 °C
Volume
Resistivity
(Ohm-cm)
1012 1012 1012
Dielectric
Strength
(Volts/Mil)
392 219 500
Dielectric
Constant
4.5 4.0 5.0
TGA Weight
Loss, % Wt,
(150°C/24 hrs)
0.1 0.1 0.1
Compressibility
@ 5 psi
25% 30%
30%
Flame
Retardancy
V-O
Equivalent
V-O
Equivalent
V-O
Equivalent

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