White Ice 510FG is a Non-Reactive, Silicone, Thermally Conductive food grade thermal grease with low thermal resistance and a soft, non-flowable consistency. This product is formulated with FDA (Food & Drug Administration) approved ingredients in compliance with CFR, Title 21 paragraph 178.3570 of the FDA guidelines and NSF Registered. This product is acceptable as incidental food contact for use in and around food processing areas.
Key Features and Benefits:
White Ice 510FG Heat Sink Compound is applied to the any electronic devices for heat transfer which is located in and around food processing areas. Also industrial applications include mounting studs of transistors, diodes and silicone controlled rectifiers. In these situations, a small amount of the thermal grease is applied using screen printing/stencil methods. It is also used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballasts; thermal joints; thermocouple wells; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.), automotive and electrical.
5 years at room temperature (25 °C) in unopened containers. Slight settling of the filler may occur during long-term storage. In this case, it is recommended to re-disperse the filler by hand or mechanical mixing. Refrigerate material at 0-10 °C to avoid any settling.
Standard approved clean-up and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite clean-up. However, when disposable containers are impractical, White Ice 510FG can be removed by cleaning solvents with such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.
Red Ice 600 series are high temperature stable thermal greases engineered with special aero space fluid technology to eliminate compound "dry out" problems due to continuous operating temperature above 200 °C. This series of thermal compounds has shown outstanding heat transfer and high temperature stability for all types of electronic and industrial applications. Recommended for aero space application because of low to zero out gassing, No dry out.
Aero Space applications, Heater cartridges, Thermistors, RTD, Thermocouple wells, Portable heaters and Tank heaters.
Most Popular Products:
Black Ice 700 series are electrically and thermally conductive greases engineered with highly conductive fillers and silicone/non silicone fluids. Excellent wetting and spreadability with screen printable consistency. The 700 series is ideal for low power applications that require static drain, grounding, and soft electronics connection. High thermal conductivity ratings up to 7 W/mºK are readily available.
High power electrical applications, Power switches, Circuit breakers, Grounding semiconductor components and high power cpu to heat sink.
TIM-Electrical Joint Compounds (EJC) is specially formulated with latest technology to prevent oxide film formation on metal surfaces and prevents corrosion. It offers superior weathering characteristics over wide temperature ranges, and provides highly conductive tight joints. Proprietary filler particles help in penetrating oxide films and act as electrical bridges between conductor strands, aid in gripping conductor, improve electrical conductivity and enhance integrity of the connection.
Surface contamination, especially surface oxide, must be expected on all conductors, these surface oxide films are insulators and must be broken down to achieve the metal-to-metal contact required for efficient electrical connections. Aluminum oxide, in particular, forms very rapidly; therefore, aluminum conductors must be thoroughly cleaned by use of an emery cloth prior to making the connection, In addition to cleaning, surface should be covered with joint compound to exclude moisture, thus preventing the oxide from reforming
Blue Ice 400 series are unique synthetic thermal greases engineered to provide low bleed and oil migration to prevent component contamination associated with silicone greases. They offer superior thermal conductivity and low thermal resistance with long term stability.
CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, TEC modules, telecommunication hardware etc.
White Ice 500 series are silicone based thermal greases engineered with special binding agents to reduce bleed and oil separation. These compounds offer excellent wetting properties, spreadability and the low viscosity formulation makes them easy to apply to thin bond line thickness for minimum thermal resistance. Timtronics silicone compounds offer superior conductivity, low thermal resistance and long term stability.
CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, TEC modules, Telecommunication hardware, Thermistors, RTD and Thermocouple wells.
TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.
Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications.
Electrically conductive adhesives are designed with pure silver and resin and are typically used for microelectronic applications. All products feature very high purity, low ionic content, wide operating temperature range and excellent electrical conductivity even after exposure of 1000 hours at 150°C.
Die-attach, chip bonding, cold soldering and other micro electronics bonding applications.
TIM-PC series are pourable, filled epoxy resin systems offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. These compounds transfer heat rapidly, thereby eliminating hot spots and increasing the operating efficiency of most encapsulated devices. The low shrinkage design feature minimizes risk of damage to fragile components.
These products are designed for protecting components in applications such as densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.