Emerson & Cuming- 285 Eccobond
ID
AVEM0285
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures
Description
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures and has good thermal cycling properties.
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet (TDS): Click Here
*Actual product shape, size and colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
Pinch Tube M/F 0.01"I/D
ID
DETE1212
$0.00
Item Details
Chemtronics- C805 Static Free Hand Guard
ID
PCCHC0805008
$0.00
Bostik- Thermogrip 6368 Hot Melt Adhesive
ID
AVBO6368
$0.00
Item Details
TS350 Series- Digital Dispenser/Controller
ID
DETE0350
$0.00
Item Details