Emerson & Cuming- 285 Eccobond
ID
AVEM0285
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures
Description
ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts. It features low coefficient of thermal expansion and good bond strength. When cured with CATALYST 23 LV, ECCOBOND 285 can be used at cryogenic temperatures and has good thermal cycling properties.
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet (TDS): Click Here
*Actual product shape, size and colours may vary from on-screen and printed representations.
Reviews (0)
There are no reviews yet.
53131 Crepe Paper
ID
ETTT3131
$0.00
Item Details
PC 627 BR Scannable Duck Tape Codes Duck Pro®
ID
PSST627BR
$79.65
Item Details
LORD- Circalok 6708 RTV Silicone Rubber
ID
AVLR6708
$0.00
Item Details
Zipwall- Aluminum Rails with Foam Edge
ID
PSZWFR200000
$117.00