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EPO-TEK- H20E-8 Electrical Epoxy
ID
AVETH208
O-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK®H20E.
Description
O-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK®H20E.
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Electrical |
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Electrical, Thermal |
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Oven, Snap |
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| 2 | |
| 3 days | |
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10,000-20,000cPs @ 20 rpm |
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| =80°C | |
| 4.85 | |
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150°C/30 min 120°C/15 min 80°C/90 min |
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| =5 kg | |
| 3.5 W/mK | |
| 26 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 66D | |
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N/A |
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Electronics Assembly, Hybrid, Medical |
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Circuit / Electronic Assembly, Electrically Conductive, Hybrids Microelectronics, Medical Epoxies, Packaging Materials, PCB Level Materials, Semiconductor , Solder Replacement |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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