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EPO-TEK- H44 Electrical Epoxy

ID AVET0H44
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EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging. Category:
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Description

EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.

Electrical
Electrical,
Thermal
Oven
1
N/A
>819,200cPs
@ 0.5 rpm
=100°C
N/A
150°C/1hr
=10 kg
Upon Request W/mK
Upon Request x 10-6 in/in/°C (below Tg)
N/A
N/A
Upon Request
N/A
Electronics Assembly,
Hybrid
Circuit / Electronic Assembly,
Electrically Conductive,
Heat Sinking,
Hybrids Microelectronics,
PCB Level Materials,
Semiconductor ,
Solder Replacement,
Wafer Level


Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here

*Actual product colours may vary from on-screen and printed representations.
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