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EPO-TEK- H77 Thermal Epoxy
ID
AVET0H77
EPO-TEK®H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.
Description
EPO-TEK®H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.
| Thermal |
|
| Thermal |
|
| Oven |
|
| 2 | |
| 6 hrs | |
| 6,000-12,000cPs @ 20 rpm |
|
| =80°C | |
| 1.4 | |
| 150°C/1 hr | |
| =5 kg | |
| 0.66 W/mK | |
| 33 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 90D | |
| N/A |
|
| Electronics Assembly, Hybrid, Semiconductor |
|
| Circuit / Electronic Assembly, Heat Sinking, Hybrids Microelectronics, Medical Epoxies, Opto-Packaging, PCB Level Materials, Potting, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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