EPO-TEK- TJ1183-LH Adhesive
ID
AVET83LH
A single component, low-halogen, electrically insulating die attach adhesive with extended pot life. Category: Thermal Conductivity: Thermal Cure Type: Oven Number of
Description
A single component, low-halogen, electrically insulating die attach adhesive with extended pot life.
Thermal |
|
Thermal |
|
Oven |
|
1 | |
9 days | |
40,139cPs @ 10 rpm |
|
108°C | |
2.6 | |
150°C/1 hr | |
29.5 kg | |
0.38 W/mK | |
N/A x 10-6 in/in/°C (below Tg) | |
N/A | |
N/A | |
N/A | |
N/A |
|
Electronics Assembly, Hybrid, Medical, Semiconductor |
|
Circuit / Electronic Assembly, Heat Sinking, Hybrids Microelectronics, Medical Epoxies, Non-Conductive, PCB Level Materials, Semiconductor |
Material Safety Data Sheet (MSDS): Click Here
Technical Data Sheet: Click Here
*Actual product colours may vary from on-screen and printed representations.
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