4558 Hot Air Leveling Tape

Used to protect gold finger contacts during the hot air leveling/wave soldering process. With excellent temperature resistance about 250°C for 5 seconds. No adhesive transfer even when there is a long delay between wave soldering and tape removal.

• Clean removal - no adhesive residue
• Fine line definition-for protecting a variety of substrates during fabrication, installation, handling and shipping
• No Film shrinkage- virtually no shrinkage of backing even at elevated temperatures
• Tough Film: will not break or tear during application or removal