4558 Hot Air Leveling Tape

ID ETGT4558
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Used to protect gold finger contacts during the hot air leveling/wave soldering process. With excellent temperature resistance about 250°C for 5 seconds. No adhesive transfer even when there is a long delay between wave soldering and tape removal. Clean removal - no adhesive residue Fine

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Description

Used to protect gold finger contacts during the hot air leveling/wave soldering process. With excellent temperature resistance about 250°C for 5 seconds. No adhesive transfer even when there is a long delay between wave soldering and tape removal.

  • Clean removal - no adhesive residue
  • Fine line definition-for protecting a variety of substrates during fabrication, installation, handling and shipping
  • No Film shrinkage- virtually no shrinkage of backing even at elevated temperatures
  • Tough Film: will not break or tear during application or removal
Specifications
1" x 36 yd
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