4558 Hot Air Leveling Tape
ID
ETGT4558
Used to protect gold finger contacts during the hot air leveling/wave soldering process. With excellent temperature resistance about 250°C for 5 seconds. No adhesive transfer even when there is a long delay between wave soldering and tape removal. Clean removal - no adhesive residue Fine
Description
Used to protect gold finger contacts during the hot air leveling/wave soldering process. With excellent temperature resistance about 250°C for 5 seconds. No adhesive transfer even when there is a long delay between wave soldering and tape removal.
- Clean removal - no adhesive residue
- Fine line definition-for protecting a variety of substrates during fabrication, installation, handling and shipping
- No Film shrinkage- virtually no shrinkage of backing even at elevated temperatures
- Tough Film: will not break or tear during application or removal
Specifications
1" x 36 yd |
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